Development of High-Temperature Control Circuitry

This Phase II SBIR proposal seeks to develop high-temperature electronics by integrating motor drive control and SiC power electronics into a single, compact, highly efficient, reliable, high power density multichip power module (MCPM). Phase II will build upon the Phase I "proof of concept" protoboard hardware. A Phase I demonstration to ARL scientists proved feasibility of the proposed APEI, Inc. technology by operating up to 250 degrees Celsius under full motor load conditions. The theoretical limit of temperature operation for the new class of SiC power semiconductors now under research is in excess of 600 degrees Celsius, bringing to light the opportunity to make major strides in power electronics miniaturization and increased power density. By developing the highly integrated MCPM technology outlined in this Phase II proposal, 90% size and weight reductions in power electronics systems can be achieved.