One-Size-Fits-All Hardened Electronic Design and Test Platform
Award amount
$2,678,850Program and phase
SBIR · Phase IIAward year
2004Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- QUICKFLEX INC.
- Proposal award date
- 2004-08-19
- Contract end date
- 2010-08-18
- UEI
- LDM7N1HHNRX7
- Solicitation number
- 2003.1
- Topic code
- MDA03-049
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- ElectronicVeil -- Advanced Security Architectures for Mobile Computing Platforms
- FlexDuo – An FPGA Accelerated, Flexible Execution Mission Processing
- ElectronicVeil - Advanced Security Architectures for Mobile Computing Platforms
- FlexDuoFPGA Accelerated, Flexible Execution Mission Processing Architecture
- A Standardized Development Suite for Decision Engines
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Producibility of Higher Density Avionics
- Silicon Carbide Steering Mirrors for High Energy Laser Applications
- Aerogel Enhanced Thermal Management Systems for STSS
- Carbon Foam Composite Tooling
- Tactically Ready Asset Condition Recorder (TRACR)
Research funding history
25 SBIR/STTR records share this UEI (2003–2020). Reported award amounts total $10,275,616. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy