A Highly Integrated Near-Hermetic Optoelectronic Packaging Technology

This proposed effort is designed to ensure that the DoD, will have access to a highly integrated, near-hermetic optoelectronic packaging and interconnect technology that will dramatically lower the cost and offer vastly improved design flexibility to current and next generation optoelectronic subsystems. The focus of this proposed effort is the initiation of a qualification program for our LCP substrate technology with "near hermetic" optoelectronic packaging of a commercially viable package design. With the substrate technology maturing on the commercial front, most of the remaining technical challenges lie in the package lid development, reliable integration of optical pigtails and optical windows, and hermetic lid sealing to the LCP base substrate. (P-040204)