Ultra-thin-Layer Heterogeneous Stack Manufacturing Process

Ballistic missile defense system components require cutting edge designs and technologies that are sometimes costly and time consuming to produce. Therefore innovative approaches that will allow economically feasible acquisition of new process technologies for components of the ballistic missile defense system are desired. Furthermore, process technology that facilitates the transition of a product (breadboard, brass board or prototype) from an R&D environment to any manufacturing environment (commercial, defense or both) is desirable. A key technology that shows bright promise is ultra-miniature electronics packaging to reduce launch costs and to ease radiation shielding thereby permitting use of less radiation resistant COTS parts. Irvine Sensors Corporation proposes to develop a low cost and reliable process for manufacturing densely packaged "systems in a stack" that dramatically reduces the weight and size of MDA systems. This packaging approach is based on the Neo-StackT technology developed at ISC. The goal is to produce heterogeneous miniature stacks containing diverse types of integrated circuits (ICs) in a design and fabrication environment that minimizes time to transition from the breadboard phase to a manufacturing environment adaptable to both defense and commercial applications. A small package size element utilizing a Power PC G4 processor will be produced.