Ultrafine Materials for Thermal Management Of Materials

This Phase II project proposes to continue development of unique advanced thermal management composites (Graphite/Cu, Mo/Cu) for the microelectronics industry based on our very encouraging Phase 1 results. Current industry practice is based on mixing of metal particles (W and Cu or Mo and Cu), resulting in long mixing times to achieve acceptable dispersion and great risk of contamination by mixing/milling media and atmospheric oxygen/nitrogen or infiltration of a sintered W or Mo skeleton by liquid Cu causing inhomogeneous copper distribution. Objectives in Phase II will include a) scale up successful liquid chemical precursor (LCP) powder production demonstrated in Phase Ito the order of kilograms per day with the purchase of high throughput mixing and furnacing equipment b) commercial scale preform processing using our ultrafine-grained composites with three partner laboratories specializing in plasma spraying, injection molding and tape casting, and c) continued achievement of very favorable thermal conductivity and thermal expansion. These efforts will result in thermal management substrates furnished to commercial customers for evaluation and comparison with state of the art shapes and materials so that commercial viability is established by the end of the program, leading to a smooth transition into Phase III.