Low Cost, Novel Electronic Packaging Technology for Digital, MMIC and Optoelectronic ICs

Foster-Miller proposes to develop a novel packaging technology suitable for mixed signal (including optical) applications. This technology will take advantage of the unique combination of properties of a class of materials known as liquid crystal polymers (LCPs) LCPs possess outstanding electrical properties up to millimeter wave frequencies, very low moisture absorption and permeation and excellent resistance to chemicals and temperature extremes. Foster-Miller has developed a patented extrusion technology to convert LCPs into isotropic (in-plane) films with coefficient of thermal expansion close to silicon and GaAs devices. Foster-Miller has also demonstrated that LCPs are capable of providing near-hermetic protection to ICs, and can be converted into high density multilayer substrates using advanced printed wiring board technologies. Foster-Miller has teamed with E-Systems, a leader in the development of Mixed Signal Modules, to develop and commercialize this generic low cost integrated packaging technology for digital, photonic, microwave and millimeter wave components in a near-hermetic package. In Phase I, key features of this technology will be demonstrated. In Phase II, technology will be further developed and optimized by fabricating and testing functional mixed signal modules. At present there is no generic technology available to package mixed signal modules. Our approach will result in a truly enabling technology. Applications for this technology will be in wireless communications, satellite communications, PCS, optically steered phased array antennas, high definition television, collision avoidance, and high speed data links. This is a potentially low cost technology which will facilitate market penetration of these high performance systems.