Improved Dielectric Gate Layer for GaN Based Devices

One of the most important problems to overcome for the development of wide bandgap metal insulator semiconductor (MIS) technology is development of high-quality gate dielectric layers. Systems & Processes Engineering Corporation (SPEC), in collaboration with the University of Texas at Austin, proposes to compare both deposited silicon nitride and aluminum nitride as the dielectric gate layer for gallium nitride based devices.During Phase I of the program, SPEC will deposit both Si3N4 and A1N on GaN substrates and determine the electrical properties of the resultant dielectric layer such as the amount of charge the gate can control and compare the results to other published data on GaN. Phase II of the program will choose and optimize the best dielectric material and deposition method, use this chosen dielectric as the gate layer on GaN devices, and demonstrate improved performance of the device.