Integrated Packages Using Innovative High Temperature Packaging/Interconnect with Metal/Ceramic Bonding

Foster-Miller proposes to develop processes for GaAs semiconductor interconnection on diamond and silicon carbide substrates for (MMIC) modules. Foster-Miller also proposes to develop high temperature bonding processes for bonding copper heat-sinks to diamond and silicon carbide substrates for (MMIC) devices, based on forming thin film adhesion layers with innovative metallurgical chemistries. In Phase I, Foster-Miller will conduct process development feasibility studies and will characterize new heatsink bonding, heatsink materials, and chip to chip interconnection materials using diamond, silicon carbide, and copper. An analysis will be performed on critical applications that require high temperature bonding processes to solve CTE and material adhesions issues. In Phase II, Foster-Miller will develop those processes found to be feasible, and in conjunction with several vendors such as Alliant Tech Systems, Honeywell and General Dynamics, fabricate specific MMIC modules. Foster-Miller will team with a specific customer to further develop this technology, with the goal of commercializing this technology in Phase III. This development will result in an innovative approach to production of MMIC modules for Phased Array systems that will be of high performance and cost effective.