Packaging And Coupling for MAnufacturable Nanophotonics (PAC-MAN)

To address the needs for practical deployable quantum systems, we propose Packaging and Coupling for Manufacturable Nanophotonics (PACMAN). This approach extends commercially successful low-loss fiber-to-chip packaging methods from telecom wavelengths to the NIR and visible regions. We will enable <1 dB loss coupling of fiber arrays to chips in the 700ñ900 nm range, sustaining >1W input power through three key innovations, namely (1) the development of ultra-low-loss edge couplers on our tantala nanophotonics platform, (2) the engineering of packaging assemblies for precision assembly and ruggedization, and (3) the automation of fiber-array-to-chip alignment systems for manufacturability. While more exotic methods for coupling light from fiber-to-chip exist, we propose the use of simple edge couplers via inverse tapers, as this approach uses proven technologies to provide a promising path towards a flexible nanophotonic device architecture that will not only provide low-loss coupling across the NIR range, but will be easily transferable to visible wavelengths, femtosecond pulses, and extreme environmental conditions. The use of fiber arrays will enable high channel counts with a single physical connection, improving SWaP and manufacturability. Of course, manual alignment of a multi-element fiber array to a chip can be time consuming, thus we will develop sophisticated methods for automating alignment and assembly process. This approach facilitates ultralow-loss coupling both on and off the chip, supporting the development of low-SWaP laser subsystems essential for critical technologies such as atomic accelerometers and clocks.The team consists of Octave Photonics ñ which brings a deep understanding of nanophotonic chip design, fabrication, and packaging ñ and oeworks, which has extensive expertise with optical device packaging and assembly automation, including machine vision and active alignment. In Phase I, we will design, simulate, and analyze our planned implementation, and in Phase II we will fabricate custom chips, test packaging strategies, and build a complete automation system for the assembly process. During the Phase II process, Octave will test prototype versions on R&D customers, receiving valuable feedback and market insight. The last half of Phase II will coincide with opening of Octaveís new fab facility, and the PACMAN platform will be implemented in the PDK for our rapid-turnaround nanophotonics fab service. This will allow customers developing quantum systems to receive complete packaged deices with low-loss connections across the visible and NIR region. Additionally, oeworks will offer the packaging automation system for commercial sale to customers doing their own packaging. Taken together, we will combine proven approaches with technological innovation to deliver a platform that satisfies the requirements of this grant, while also remaining flexible to maximize the impact across government, research, and industry.