ORDERED POLYMER FILM FOR ADVANCED PRINTED WIRE BOARD APPLICATIONS

HIGH PERFORMANCE ELECTRONIC CIRCUITS ARE EXCEEDING THE LIMITS OF EXISTING PACKAGING MATERIALS. RECENT DEVELOPMENTS IN SURFACE MOUNTING LEADLESS CHIPS, MULTI-LAYER CONSTRUCTION, AND HIGH SPEED DENSITY PACKED CIRCUITS DEMAND INNOVATIVE NEW MATERIALS. THE OBJECTIVE OF THIS PROGRAM TO DETERMINE THE FEASIBILITY OF NEW MATERIALS. PBT (POLYBENZTHIAZOLE) ORDERED POLYMER FILMS AS A SUBSTRATE MATERIAL IN ADVANCED ELECTRONIC PACKAGING. PBT FILMS PROVIDE THIN HOMOGENEOUS MATERIALS WITH EXCELLENT PROPERTIES, AVOIDING PROBLEMS ASSOCIATED WITH REINFORCED COMPOSITE MATERIALS OR HEAVY METALLIC AND CERAMIC SUBSTRATES. PBT FILMS WILL BE PRODUCED AND TESTED WITH RESPECT TO: EXCELLENT MATERIAL PROPERTIES NAMELY, LOW COEFFICIENT OF THERMAL EXPANSION (MATCHED TO LEADLESS CERAMIC CHIP CARRIERS) AND LOW DIELECTRIC CONSTANT AND DISSIPATION FACTOR; ABILITY TO BOND CONDUCTIVE PATHS, ESPECIALLY FOR ADDITIVE PROCESSES; AND ABILITY TO BE LAMINATED IN MULTI-LAYER CONSTRUCTION. THE MECHANICAL AND DIELECTRIC PROPERTIES WILL BE MEASURED, COMPARED WITH OTHER MATERIALS, AND FEASIBILITY WILL BE EVALUATED AGAINST BENCHMARKS DETERMINED FOR PHASE I. SURFACE TREATMENT AND CONDUCTIVE PATH PRINTING TECHNIQUES WILL BE TESTED AGAINST EXISTING MILITARY SPECIFICATIONS FOR PEEL STRENGTH. TECHNIQUES WILL BE IDENTIFIED FOR LAMINATING PBT FILMS IN MULTI-LAYER FASHION AND SAMPLE WILL BE TESTED FOR ADHESION. THE PHASE I PROGRAM WILL DEMONSTRATE WHETHER OR NOT PBT FILMS ARE FEASIBLE WITH REGARD TO THE MOST CRITICAL REQUIREMENTS FOR ADVANCED PRINTED WIRING BOARDS.