Development of Packaging and Integration of Sensors for On-Line Use in Harsh Environments
Award amount
$840,315Program and phase
SBIR · Phase IIAward year
2010Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- MESOSCRIBE TECHNOLOGIES, INC.
- Proposal award date
- Not reported
- Contract end date
- 2012-08-14
- UEI
- W1BVWTLV53E1
- Solicitation number
- DE-FOA-0000350
- Topic code
- 31 b
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Recession-Tolerant Sensors for Thermal Protection Systems
- Direct Write Lightning Protection and Damage Detection
- Recession-Tolerant Heat Flux Sensors for Thermal Protection Systems
- Self-Powered Wireless Sensors for Gas Turbine Power Systems
- A Structurally-Integrated Ice Detection and De-Icing System for Unmanned Air Vehicles
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- A Scalable High Performance Data Distribution Middleware for High Energy Physics Applications
- Harsh Environment Sensor Packaging (Sensor Pack)
- Standardized Sensor Packaging for Harsh Environment
- Development of Packaging and Integration of Sensors for On-Line Use in Harsh Environments
- Flow Channel Inserts Based on Syntactic Closed-Cell SiC Foam for Dual-Coolant ITER Test Blanket Modules
Research funding history
47 SBIR/STTR records share this UEI (2002–2015). Reported award amounts total $15,634,284. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy