SBIR/STTR Research Award

SBIR Phase I: Fabrication of Conformal Antennas for Airborne SatCom Using Kinetic Metallization

Award identifier 77b0ef61a094d2128ef12c3975d9a5a57166558fd89c775f4df0da25910bd889Awarding agency National Science Foundation

Award amount

$99,946

Program and phase

SBIR · Phase I

Award year

2006

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
INNOVATIVE TECHNOLOGY INC
Proposal award date
Not reported
Contract end date
Not reported
UEI
JNF2RJTUL2J3
Solicitation number
NSF 05-557
Topic code
EL

Research abstract

This SBIR Phase I proposal will demonstrate a complete approach for net shape or in situ fabrication of multi-layer conformal antennas suitable for airborne satellite communications (SatCom). To satisfy future SatCom requirements for high performance aircraft, broadband apertures for C-band uplink/downlink must be integrated conformal to the aircraft body. Multi-layer micro-strip antenna arrays are a pathway to meeting this need if fabrication methods can be devised to produce robust, multi-layer conductor and dielectric structures in doubly-curved topologies. Traditional planar antenna structures and materials do not yield gracefully into complex shapes. A viable manufacturing approach must be devised to allow conformal antenna structures to be directly fabricated in the desired net shape. The company has developed and patented a room temperature and pressure, high velocity metal powder coating process known as Kinetic Metallization (KM) that can be employed to prepare ground planes, micro-strip antenna elements, and feed networks on a variety of moldable dielectric substrates in arbitrary 3D geometries. This will facilitate the design space necessary for devising a new class of broadband conformal airborne SatCom apertures. The broader success for this effort will be a low-cost approach to fabricating arbitrary micro-strip or array antenna configurations for a wide range of frequency bands (UHF through SHF), creating an affordable option for many military and commercial satellite link applications. The low-cost commercialization potential derives from the ability to perform direct pattern printing of low loss conductors on proven dielectric substrates at room temperature and pressure, in a mass assembly facility without the overhead of hazardous materials or processes.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

40 SBIR/STTR records share this UEI (1983–2024). Reported award amounts total $15,715,803. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Science Foundation, Department of Health and Human Services, Environmental Protection Agency, Department of Agriculture, Department of Energy

Agency intelligence

National Science Foundation

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