Stacked High-capacity High-Speed Serial 10K Superconductor Memory Modules

This proposal is to combine the proven high density 3D packing technology with the ultra high performance of low temperature superconductor memory technology. The maturity level of the memory is approaching 16 Kbits per square centimeter. The memory is akey enabler for superconductor electronics processing but to be practical for near-term applications, larger blocks of this memory must be assembled into very compact packages which maintains the high speed and low latency attributes of the very highspeed, ultra low power memory technology. The dense packing technology as developed by ISC provides such an assembly capability. The focus will be on developing a high density NbN, serial memory module of 4 Mb capacity in a footprint of few cm2. Serialsuperconductor memory is the only memory technolgy that provides the speed of access and sata transfer rates necessary to match future requirements of ultra fast processors for focal plane array signal processing and high density, ultra fasttelecommunication switches.