SBIR/STTR Research Award

SBIR Phase I: Improvements in Reliability of Semiconductor Products Using Magnetic Current Imaging for Fault Isolation of Open Circuits

Award identifier 5c621b934b1a998fa978d2186113875387078bf31ba0aaf5fdbfed7fa9ce37e9Awarding agency National Science Foundation

Award amount

$99,067

Program and phase

SBIR · Phase I

Award year

2006

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
NEOCERA, LLC
Proposal award date
Not reported
Contract end date
Not reported
UEI
RGN2BNEVNG73
Solicitation number
NSF 05-557
Topic code
EL

Research abstract

This Small Business Innovation Research (SBIR) Phase I project will extend the capabilities of magnetic current imaging to detect open failures in semiconductor packages with an accuracy of 30 microns. The largest, most difficult problem encountered in packages is electrical opens due to increasing shrinking and complex technology in leading edge designs. The only available techniques are time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. There is a critical need for a faster, non-destructive and more reliable technique capable of locating opens at a level commensurate with todays package level wiring, 30 micron pitch and able to extend to future wiring pitches approaching 10 micron. It is proposed to use magnetic current imaging with a SQUID sensor to solve this critical need. Two approaches will be attempted: one is to increase the frequency detection limit of the equipment to detect high frequency signals at the defect location. The second is to use the SQUID to detect radio frequency signal emitted by the defect at higher frequency signals. It is expected that one or both of these approaches to be able to detect opens with a resolution of about 30 micron. Commercially, the semiconductor industry has a critical need for localization of buried open defects in packages with resolution below 30 microns. The proposed technology is targeting a 30 micron resolution to fill a known gap in fault isolation technology for packaging. For the semiconductor companies it will enable the packaging manufacturing sites to isolate open defects and improve their manufacturing processes to minimize or eliminate these defects quickly so that they can get high quality reliable products to market faster. For the nation, it means faster introduction of advanced electronics that will have a broad impact across all industries and ultimately improve quality of life and labor productivity.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

43 SBIR/STTR records share this UEI (1989–2009). Reported award amounts total $7,573,684. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, National Science Foundation, Department of Commerce, Department of Energy

Agency intelligence

National Science Foundation

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