Thin Film on Stack (TFS) FPA

The objective of the Phase I SBIR effort is to develop and demonstrate novel Thin film on Stack (TFS) FPA detector concepts that will enable economically feasible acquisition of smaller, lighter, more powerful imaging/processing components for theballistic missile defense system. Irvine Sensors proposes to combine its stacked silicon technology with photo-conductive coating technologies from TREX Enterprises Corporation. The photo-conductive coatings are not only lower cost than conventionaldetector arrays, but offer promise of easier alignment and processing of staking technology. On the other hand, stacking technology offers the promise of extensive signal processing and easy fabrication of curved focal planes and large arrays made ofbuttable modules. By accurately curving the focal plane, optics designs can in some applications be simplified leading to lower overall sensor size weight and cost. The combination of both technologies have promise for small, inexpensive, powerful, veryhigh resolution, sensors with less than 7 micron pixel size. The proposed innovation will find use in image systems on all platforms, for military space, Air Force, commercial aviation, ATR, and commercial space.