Readout Electronics for Three-Dimensional Semsors

The innovation is a compact focal plane assembly consisting of a 3D stack of readout electronics (ROE) and a very high resolution image sensor (see Figure 1). Its innovativeness is in the application of stacked memory performance attributes (extremely dense electronics and short, massively parallel, low capacitance connections) to high resolution sensor performance problems. Many short sensor outputs connect the sensor to the ROE, and much more circuit area is behind each sensor line than in conventional planar hybrid FPAs. The large circuit area behind each sensor line, and fast, short interconnections address the following needs from the solicitation: 1. Sub-electron read noise for detector arrays: Large geometry, low noise preamplifiers minimize read noise, and ADCs make focal plane outputs more robust 2. Thermal isolation of electronics in cryogenic dewars: A large number of parallel, slower circuits (especially ADCs) dissipate less power than a single multiplexed fast circuit. Internal generation of logic signals reduces the thermal load from I/O wires through the dewar wall. 3. Event driven readout of large detector arrays. There is enough area on the focal plane to provide event driven logic.