HIGH DENSITY RECORDER

Systems & Processing Engineering Corporation proposes to develop a High Speed High Density Solid State Recorder to meet the data rate and storage requirements of the next generation reconnaissance sensors. The recorder will have a high data throughput, low bit error rate, high density storage and be capable of operation in an airborne environment. The design will exploit the use of memory technologies such as micro ball grid array, flip chip technology, state-of the-art Synchronous Dynamic Random Access Memory, Electrically Erasable Programmable Read-Only Memory. Other technologies including Application Specific Integrated Circuit and Multi-Chip Module technologies will be used to meet stringent volume and performance requirements and increase reliability.The baseline configuration will be capable of storing 1500 Gb of data with a sustained data rate of greater than 10 Gbps and a maximum BER of 1E-14 in a volume of less than 1.5 cubic feet. The modular design approach allows for customization of data inputs, outputs and memory configurations as well as enhanced reliability and maintainability. Power management techniques will be incorporated to limit power consumption to less than 100W.