MULTICHIP INTERCONNECT SUBSTRATES

IN THE PHASE I PROGRAM FOSTER-MILLER WILL DEVELOP AN INNOVATIVE APPROACH TO PACKAGING CHIP-ON-BOARD MULTICHIP MODULES USING CONTROLLED COEFFICIENT OF THERMAL EXPANSION (CTE), HIGH THERMAL CONDUCTIVITY SUBSTRATES AND TAILORED DIELECTRIC FILM LAYERS FOR INTERCONNECTION. OUR APPROACH WILL OVERCOME FOUR OF THE MAJOR PROBLEMS FOR HIGH DENSITY INTERCONNECTION: REMOVAL OF HEAT, HERMETICITY, THERMAL EXPANSION AND UNIFORM THICKNESS DIELECTRIC LAYERS. WE WILL USE A NEW HIGH PERFORMANCE POLYMER FILM MADE FROM POLY BENZOBISTHIAZOLE (PBZT) OR POLY BENZOBISOXAZOLE (PBO) IN CONJUNCTION WITH NEW SILICON-ON-SILICON MULTICHIP MODULES. THIS APPROACH WILL PERMIT A HIGH MODULARITY IN DESIGN, AND WILL ACHIEVE AN INTERCONNECTION DENSITY NOW ONLY POSSIBLE FOR SEMICONDUCTOR CIRCUITS.