Embedded Optical Links (EOL) for 3D Communication in Stacked Multi-Chip Modules

A novel optoelectronic packaging technique to accommodate optical interconnections in 3D stacks of electronic multi-chip modules is proposed. Optoelectmnic I/0 components such as vertical cavity surface emitting laser or light emitting diodes and receivers will be embedded side by side with silicon logic circuits using novel and simple potting technique based on a transparent epoxy. These optically interconnectable layers will be stacked to form a monolithic-like rugged structure with enhanced overall performance. Proposed implementation will allow to interchange the technology of the supporting elements without any disturbance to the original integration technology. Flexibility and the transparency of the potting medium may eliminate the need of through substrate links. Therefore, off-the-shelf optoelectronic and electronic components can be used without any design modification, lowering the cost and enhancing the manufacturability. Optically interconnected modules will be critical to applications that requires large among of data exchange and processing, such as optical switching, sorting and Fast Fourier Transform (FFT). Military applications will include processing airborne reconnaissance target recognition, naval/airborne/land multiple sensor fusion and associated real-time data processing. Commercial applications will include high capacity public switches, data compression/decompression such as in medical images, high speed interface to large data bases in optical memories.