Radiation-Hard Vacuum Fields Emission Triode Using a Diamonf Microtip

Systems & Processes Engineering Corporation (SPEC) offers to develop a miniaturized solid state data recorder for monitoring missile/bomb impact events. Data recorder capability is to be matched to Government requirements. The compact, ruggedized recorder is to be implemented with high-density non-volatile memory packaged in a novel high-G shock-hardened vertically integrated multichip module (VMCM). To execute the program, SPEC is joined by Pico Systems. SPEC possesses data recorder design expertise supported by strong microelectronic integration and test experience. Pico offers a shock hardened MCM technology with lower non-recuring engineering (NRE) costs compared to other MCM technologies of the same circuit densities. Together, SPEC and Pico offer the government a synergistic approach to problem solution. SPEC, assisted by PICO, will investigate additional implementations for the shock hardened data recorder beyond the single layer, single substrate baseline. The first variant is a single substrate double layer (piggy backed) recorder. This approach features DRAMs and EPROMs which are piggy backed so that component density doubles at modest increase in cost. The second variant features a vertical stack of the baseline substrate. A third variant depicts a vertical stack of the substrate with double memory layer (piggy backed).