Long-Word Wide (32 Bit) Memory

Irvine Sensors proposes to develop a 3D silicon long-word (32 bit) wide memory component, suitable for direct replacement of existing 2D byte wide memory product. 3D silicon technology has been historically applied towards achieving a one to two generation advancement in memory devices for a very low cost. However, many embedded systems and pocket computers can significantly benefit from a reduction in total parts to reduce their X-Y size and associated substrate costs, and an increase in performance due to reductions in circuit trace length and capacitance. 3D silicon is the enabling technology to provide a long-word (32 bit) memory component to readily achieve these goals. Because of this critical need Irvine Sensors is proposing an SBIT Phase I and Phase II program to develop a long-word (32 bit) wide memory component. Anticipated Benefits: The development of long-word wide (32 bit) memory components will radically shrink the size and therefore cost of existing MCMs. All embedded MCMs that incorporate a microprocessor require memory typically in 32 to 64 bit chunks. However, the semiconductor industry typically supplies memory only as 4 and 8 bit devices. Because of this, the size of MCM is largely dictated by the memory requirements of the system.