High Speed Data Acquisition Module

Systems & Processes Engineering Corporation (SPEC) proposes to develop a high speed data acquisition module using state-of-the-art GaAs integrated circuit and Multi-Chip Module (MCM) technologies. The data acquisition MCM will include an 8-bit ADC, a custom GaAs integrated circuit, 32 Kbytes of RAM, and an 8-bit microcontroller to provide control and serial communications. The module will operate in a continuous acquisition (wrap-around) mode enabling storage of pre-trigger data. The custom IC will be implemented in Vitesse Semiconductor's 0.6 micron GaAs process for operation at a minimum of 300 MHz, with a goal of 500 MHz. A high bandwidth memory interface will be designed to take advantage of high speed, high density BiCMOS static RAMs for extended waveform storage. The GaAs IC will include a phase-locked Voltage Controlled Oscillator (VCO) to generate the sample clock, and registers, programmable by the microcontroller, to control the amount of pre-trigger delay. Data acquisition can be enabled by the microcontroller or by an external "enable acquisition" signal. An internal threshold comparator can be set for automatic level triggering, or an external "stop acquisition" signal can be applied to terminate data acquisition.