Flexible Integrated Circuits for Conformal Multi-Modular Packaging

A novel packaging technique to allow integrated circuits to conform to the external shapes is proposed. Circuits are thinned to a level where silicon can be bend without breaking and bonded to a flexible backing material. The resulting package will have enhanced high frequency characteristics due to removal of the substrate parasites. Any circuit with various technology origin and complexity can be joined on the same backing substrate. Proposed implementation will allow to interchange the technology of the supporting elements without any disturbance to the original integration technology. Off-the-shelf components can be used without any design modification, lowering the cost and enhancing the manufacturability. Flexible circuits can be used where space is premium and odd shapes needs to be maintained. Roll-up displays, wrist-worn electronic products, shape conforming sensors, flexible smart cards are among many products that can benefit directly. Furthermore, the thinning allows the removal of mass, thus enhancing radiation tolerance, ruggedness under extreme acceleration and increases high frequency performance especially for personal communication devices.