Low-Cost, Opto-Electronic, Multichip Modules

After decades of dramatic advances in optoelectronic device performance, it is clear that the implementation of fiber optic systems has been retarded by inadequate packaging technology. Commercially available packaged components often suffer from uncertain reliability, high unit cost and low functionality. Also, the intrinsic performance of the device is frequently compromised by parasitic element associated with poor packaging technology. The program described in this proposal addresses the challenges specific to optoelectronic device packaging. Foster-Miller intends to develop a new and innovative packaging concept that promises to satisfy reliability requirements, preserve device performance, and, at the same time, offer a cost-effective approach to hybrid integration. Cost reduction will be effected by, utilizing passive alignment technique for optical I/O, and an innovative liquid crystal polymer-based multichip packaging technology. Further cost reduction, at the system level, will result from the increased functionality and reliability of a multichip packaging approach. The extension of the microelectronic MCM concept to the optoelectronic MCM, or OMCM, is the core of the proposed program. Foster-Miller believes that there are compelling reasons, rooted in optimizing the mix of cost, performance and reliability, to adopt the module discipline for optoelectronic packaging. The proposed program in this Phase I effort will establish the foundation for the next generation of optoelectronic subsystems.