HIGH-SPEED HIGH-DENSITY VIDEO DATA MEMORY SYSTEM

IRVINE SENSORS CORPORATION (ISC) PROPOSES TO APPLY ITS 3-D PACKAGING TECHNIQUE IN DEVELOPING A SOLID STATE, HIGH-SPEED, HIGH-DENSITY MEMORY SYSTEM. THIS SOLID STATE MEMORY SYSTEM WILL BE CAPABLE OF STORING DATA FROM THE MOST ADVANCED IMAGERS AND FIT WELL WITHIN THE 200 CUBIC INCH VOLUME REQUIREMENT. THE SYSTEM WILL BE CONFIGURED TO BE AS GENERIC AS POSSIBLE. SINCE THE MEMORY SYSTEM IS SOLID STATE AND HAS NO MOVING PARTS, IT CAN WITHSTAND THE MOST SEVERE OF ENVIRONMENTS. THE SYSTEM CAN ALSO BE CONFIGURED WITH DIFFERENT MEMORY IC TECHNOLOGIES (SRAM, DRAM, EEPROM, FERROELECTRIC) TO BEST FIT THE SPECIFIC APPLICATION REQUIREMENTS. THE PRESENTLY DEMONSTRATED ISC 3-D PACKING DENSITY IS ABOUT ONE FOURTH OF THAT REQUIRED FOR THE VIDEO DATA MEMORY APPLICATION, UTILIZING 32 LAYER MODULES WITH 400 MICRON THICK LAYERS. THE PROPOSED INNOVATION IS TO REDUCE LAYER THICKNESS TO 100 MICRONS, EMPLOYING TECHNIQUES PREVIOUSLY DEMONSTRATED IN IR DETECTOR READOUT MODULE APPLICATIONS. THE PROPOSED PHASE I PROGRAM WILL DETERMINE THE OPTIMAL MODULE ARCHITECTURE FOR VIDEO DATA MEMORIES, AND THE PHASE II PROGRAM WILL PERFORM HARDWARE DEMONSTRATIONS OF COMPATIBLE MEMORY MODULES.