New Imaging X-Ray Sensor Technology for Real-Time Nondestructive Testing

X-ray imaging is an important technique which is used in variety of applications such as general radiology in medicine, astronomical observations, non-destructive testing, X-ray diffraction for materials studies and others. The ability of X-rays to penetrate deep in to matter allows investigation of interior components with possibility of real-time dynamic studies. However, while significant advances have been made in X-ray sources as well as image processing steps, the X-ray detectors remain a limiting step in many of applications Important requirements for the X-ray detectors used in such applications include large area (z 20 cm x 20 cm), high resolution (100-200 1lm), wide dynamic range (104), high sensitivity, and low cost. Ability to provide real-time images is an additional requirement in some applications. To address this, we propose to develop a solid state, large area, high resolution imaging detector by combining the semiconductor film (lead iodide, PbI2) technology being developed at RMD with the large format amorphous silicon (a-Si:H) readout technology which has been developed by our collaborators at OIS in Troy, Michigan. The detectors are expected to be useful in both static as well dynamic (or real-time) X-ray imaging applications and thus will have far reaching utility in advancing X-ray imaging.