SBIR/STTR Research Award
SBIR Phase I: Lead-Free Sintering Adhesives for Electronics Thermal Management
Award amount
$99,998Program and phase
SBIR · Phase IAward year
2009Award details
- Awarding agency
- National Science Foundation
- Branch
- Not reported
- Recipient company
- CREATIVE ELECTRON INC
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- TKEGY5ZHLDJ8
- Solicitation number
- NSF 08-548
- Topic code
- EL
Research abstract
This Small Business Innovation Research Phase I project will develop and characterize lead-free adhesives with very high thermal and electrical conductivity for wide bandgap semiconductor packaging. The company will build on its IP portfolio of fluxing adhesive binder systems to formulate polymer fluxes suitable for low-temperature, lead-free solders. The development of cost effective, high performance packaging systems will hasten the adoption of wide bandgap semiconductor components for high power electronic and optoelectronic applications. This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- SPARTA – Smart Phone App for Radiological Threat Adjudication
- Nano-Sintered High Thermal Conductivity Composites
- MVR - Medical Voice Recorder
- SBIR Phase II:Lead-Free Sintering Adhesives for Electronics Thermal Management
- Sintered Conductive Adhesives for High Temperature Packaging
Research funding history
10 SBIR/STTR records share this UEI (2008–2012). Reported award amounts total $3,017,112. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Homeland Security, National Science Foundation, Department of Energy