Sintered Conductive Adhesives for High Temperature Packaging
Award amount
$99,990Program and phase
SBIR · Phase IAward year
2009Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- CREATIVE ELECTRON INC
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- TKEGY5ZHLDJ8
- Solicitation number
- DE-PS02-08ER08-34
- Topic code
- 24 c
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- SPARTA – Smart Phone App for Radiological Threat Adjudication
- Nano-Sintered High Thermal Conductivity Composites
- MVR - Medical Voice Recorder
- SBIR Phase II:Lead-Free Sintering Adhesives for Electronics Thermal Management
- Standalone Multiple Anomaly Recognition Technique (SMART)
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Development of a 1,000 level Borehole Seismic Receiver Array for Characterization of CO2 Repositories
- High-temperature Packaging of Planar Power Modules by Low-Temperature Sintering of Nanoscale Silver Paste
- High-temperature Packaging of Planar Power Modules by Low-Temperature Sintering of Nanoscale Silver Paste
- Sintered Copper Ink as a Low Cost Replacement for High Temperature Solders
- Solar Energy, Materials Solutions for Cells and Modules
Research funding history
10 SBIR/STTR records share this UEI (2008–2012). Reported award amounts total $3,017,112. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Homeland Security, National Science Foundation, Department of Energy