Built-In Electrofluidic Thermo-Management of Solid-State Illumination Arrays

High brightness light emitting diodes (HB LEDs) have demonstrated promise for general illumination applications. However, the unavailability of adequate thermal management solutions limits the use of their superior advantages, such as high energy efficiency, low-temperature operation, robustness, digital control, low-voltage operation, and long life. The unresolved heat causes the LED junction temperature to rise, which limits the life of the light source and also causes color shifts. This project addresses this problem by using electrostatically-enhanced, two-phase thermal transporters, which are embedded into the epoxy casing of multiple HB LEDs, in order to provide a thermal resistance near 4°C/W between the LED junction and the ambient environment. The transporters of the proposed system will efficiently extract heat from each LED junction and direct it to an ultra-compact system heat sink, which will be convectively cooled by a cluster of ion-driven air microjets. Commercial Applications and other Benefits as described by the awardee: By creating a practical means for cooling HB LED arrays, the new system will allow conventional light bulbs to become LED-based. Because of their high energy efficiency and extreme longevity, significant energy savings would be realized and the production of waste would be reduced. The core technology also should find application in a number of industries that require thermal management solutions.