Megacube: Very Large Highly Interconnected FPA Technologies

THIS PROPOSAL IDENTIFIES THE ULTRA-DENSE MICRO CONNECTOR (UMC) BONDING FACE. THE UMC IS PLUG-IN-SOCKET WITH A FUZZ BUTTON BASE THAT CREATES A RESEALABLE, SELF-ALIGNING, INTERCONNECTOR NEEDED TO BUILD STACKS OF COMPUTER CHIPS INTO THE MEGACUBE. THE MEGACUBE IS THE NEXT STEP BEYOND HYBRID MOSAIC ON STACKED SILICON. BY FLIPPING COMPUTER STACKS ON THEIR SIDE AND BONDING THEM WITH OTHER COMPUTER STACKS, WE ARE ABLE TO DECOUPLE THEIR PITCH FROM SPACING IN THAT AREA AND CREATE THE MEGACUBE. WITH THIS CONSTRUCTION, THE MEGACUBE HAS TRUE PARALLEL BUSSING WITH LATERAL PROCESSING. THE MEGACUBE SIGNIFICANTLY INCREASES THE PROCESSES PER TIME AND PER AREA THAT CAN BE DONE. THIS PROCESSOR GROUPING CAN BE ADAPTED TO INCORPORATE COMPUTATIONS AT THE SENSOR TO INCREASE THE PERFORMANCE. ALGORITHMS CAN BE USED IN THE OUTPUT OF SUCH SENSORS.