Low Cost Attitude and Heading Reference System for Phased-array Antennas

As advancements in the semiconductor industry continue at a phenomenal pace, traditional printed wiring board (PWB) materials and technologies are approaching significant limitations. Higher density interconnections are required between ICs. Circuitsoperating in the microwave region and beyond require a lower dielectric constant, and higher operating temperatures are being specified for many applications. The need for higher density interconnection substrates is fueled by ever-shrinking consumer andtelecommunications products. Consumers are looking for products that are the absolute smallest, lightest weight, and feature rich in their class. The competition in these markets is fierce and the need is urgent.To address this critical need in both the military and commercial sectors, Foster-Miller proposes to demonstrate the extraordinary properties of a new class of electronic substrate materials known as liquid crystal polymers (LCPs). Foster-Miller has beendeveloping an electronic packaging technology based on these innovative LCPs for microwave multichip modules, advanced surface mount printed wiring boards and optoelectronic applications. Foster-Miller has recently commercialized a novel low-cost LCPmaterial for these advanced applications and the focus of this SBIR effort will be to help establish a commercial production facility for fabricating LCP-based PWBs. (p00696)