AN INTEGRATED MODELING TOOL FOR RAPID ASSESSMENT OF RELIABILITY

ANALYSIS TOOL TO PROVIDE RELIABILITY ASSESSMENT OF MICROELECTRONIC DEVICES/ ASSEMBLIES SUBJECTED TO THERMAL AND MECHANICAL STRESSES. FOSTER-MILLER WILL USE A UNIQUE MODELING APPROACH, KNOWN AS "BOND GRAPH TECHNIQUE", TO MODEL AND ASSESS RELIABILITY IN COUPLED ENERGY DOMAINS (ELECTRICAL, THERMAL, AND MECHANICAL) SIMULTANEOUSLY. BOND GRAPH TECHNIQUE IS AN ENERGY-BASED ANALYSIS TOOL WHICH MAKES THE DIFFERENCES IN ENERGETIC SYSTEMS TRANSPARENT. THIS SIMPLIFIES SETTING UP THE E^UATIONS OF STATE AND ALLOWS THE USER TO VIEW THE OVERALL SYSTEM, UNDERSTAND THE RELIABILITY IMPLICATIONS AND ISOLATE PROBLEM AREAS FOR FURTHER ANALYSIS. IN PHASE I, WE WILL DEMONSTRATE KEY CONCEPTS OF OUR PROPOSED APPROACH WITH A SIMPLE TEST CASE GEOMETRY SUBJECTED TO THERMAL AND MECHANICAL STRESSES OF MIL-STD TEST METHODS. IN ADDITION TO PREDICTING DYNAJUIC STRESS AND TEMPERATURE DISTRIBUTIONS, THE MODEL WILL ALSO PREDICT THE IMPACT OF THESE TESTS ON THE ELECTRICAL PERFORMANCE OF THE SYSTEM. BY INCLUDING A SMALL DATABASE OF FAILURE CRITERIA FOR TEMPERATURE, STRESS AND TOLERANCES ON ELECTRICAL PARAMETERS, WE WILL DEMONSTRATE THE MODEL'S ABILITY TO IDENTIFY PROBLEM AREAS. THE SKELETON RELIABILITY ASSESSMENT TOOL DEMONSTRATED IN PHASE I, WILL BE EXPANDED TO INCLUDE A COMPREHENSIVE DATABASE CONSISTING OF STANDARD CELLS TO REPRESENT COMPONENTS AND INTERCONNECTS (WHICH CAN BE NETWORKED TOGETHER TO REPRESENT ANY ELECTRONIC ASSEMBLY), FAILURE MODELS, AND ALL APPLICABLE MIL-STD TEST CONDITIONS IN PHASE II. DEVELOPMENT OF A USER-FRIENDLY INTERFACE AND ON-SITE EVALUATION BY SELECTED OEMS INCLUDING HONEYWELL SOLID STATE ELECTRONICS DIVISION IN PHASE II WILL ESTABLISH A FIRM BASIS FOR A COM MERCIALLY FUNDED CAD TOOL DEVELOPMENT IN PHASE III. THIS TOOL WILL PERMIT EVALUATION OF ELECTRONIC ASSEMBLIES SUBJECTED TO DYNAMIC