SPACE FLIGHT SUPERCOMPUTER

THE PHASE I EFFORT WILL DESIGN A THREE-DIMENSIONAL PACKAGED FLIGHT SUPERCOMPUTER. THE SUPERCOMPUTER WILL BE BASED ON A PARALLEL PROCESSING ARCHITECTURE WITH A PROGRAMMABLE TOPOLOGY THAT WILL ALLOW OPTIMUM PERFORMANCE WITH A WIDE RANGE OF PROGRAMS. THE FIRM WILL COMPLETE THIS PRELIMINARY DESIGN IN ACCORDANCE WITH SPECIFIC SPACECRAFT APPLICATION GUIDELINES OBTAINED FROM THE SPONSOR; THE RESULT WILL BE A DEMONSTRATION RECOMMENDATION FOR THE PROCESSING UNIT DURING PHASE II. THE PHASE I ANALYSES WILL ESTABLISH SYSTEM REQUIREMENTS AND CONSTRAINTS, AND DETERMINETHE FEASIBILITY OF CONSTRUCTING A THREE-DIMENSIONAL PROCESSING MODULE. THE FIRM PLANS TO COMPLETE PERFORMANCE PREDICTIONS FOR THE ULTIMATE SYSTEM AND A PRELIMINARY PHASE II PROGRAM PLAN. THE FIRM ALSO PLANS TO DEVELOP PRELIMINARY SPECIFICATIONS FOR A PHASE II BREADBOARD DEMONSTRATION OF THE FLIGHT SUPERCOMPUTER THAT WOULD INCLUDEESTIMATES OF TOTAL ELECTRONICS VOLUME, WEIGHT, AND POWER BUDGETS AS A FUNCTION OF DEGREE-OF-PROCESSING POWER. THERMAL ISSUES WILL ALSO BE ADDRESSED. THE PHASE I EFFORT WILL DESIGN A THREE-DIMENSIONAL PACKAGED FLIGHT SUPERCOMPUTER. THE SUPERCOMPUTER WILL BE BASED ON A PARALLEL PROCESSING ARCHITECTURE WITH A PROGRAMMABLE TOPOLOGY THAT WILL ALLOW OPTIMUM PERFORMANCE WITH A WIDE RANGE OF PROGRAMS. THE FIRM WILL COMPLETE THIS PRELIMINARY DESIGN IN ACCORDANCE WITH SPECIFIC SPACECRAFT APPLICATION GUIDELINES OBTAINED FROM THE SPONSOR; THE RESULT WILL BE A DEMONSTRATION RECOMMENDATION FOR THE PROCESSING UNIT DURING PHASE II. THE PHASE I ANALYSES WILL ESTABLISH SYSTEM REQUIREMENTS AND CONSTRAINTS, AND DETERMINETHE FEASIBILITY OF CONSTRUCTING A THREE-DIMENSIONAL PROCESSING MODULE. THE FIRM PLANS TO COMPLETE PERFORMANCE PREDICTIONS FOR THE ULTIMATE SYSTEM AND A PRELIMINARY PHASE II PROGRAM PLAN. THE FIRM ALSO PLANS TO DEVELOP PRELIMINARY SPECIFICATIONS FOR A PHASE II BREADBOARD DEMONSTRATION OF THE FLIGHT SUPERCOMPUTER THAT WOULD INCLUDEESTIMATES OF TOTAL ELECTRONICS VOLUME, WEIGHT, AND POWER BUDGETS AS A FUNCTION OF DEGREE-OF-PROCESSING POWER. THERMAL ISSUES WILL ALSO BE ADDRESSED.