High Power RF Windows for Accelerator Applications

High power RF windows are failing due to single surface multipactor. A more effective and robust technique is required to address this problem. This program will investigate two approaches for addressing multipactor failure in high power windows. The first will explore improved methods for depositing surface films to reduce secondary electron emission. The second approach will investigate changes to the surface chemistry to eliminate requirements for a surface film. Commercial Applications and Other Benefits: This technology would be applicable for high power RF windows for accelerators and microwave RF sources. This would eliminate costly failures and increase the power transmission capability of ceramic windows.