Electronics and Superconductivity Integrated Passive Components via Soft Lithography""

"As the number of passive components in electronic circuits increases, new interconnect technologies, such as embedded passives, are under development to optimize utilization of board real estate. For embedded passives, dimensional accuracy translates intocontrol over component values, and so there is a need for high-precision fabrication processes.TPL has developed soft lithography microcontact printing (¿CP), an additive process that can fabricate near-net-shape structures with features between 100mm and the sub-micron scale. The innovation exploits the compositional flexibility of sol-gelchemistry to synthesize powder-free inks with a wide range of materials properties that can be patterned with high resolution using the novel ¿CP technology. It is anticipated that this process will enable integration of passive components that show thinfilm performance, but at thick film cost.In the proposed effort, TPL will use ¿CP to print high-density arrays of resistors with a large range of component values. Successful completion of the effort will demonstrate the feasibility of ¿CP for application to high-density interconnect solutions,and could be an enabling technology for high-precision embedded passives.The PI has pioneered the use of ¿CP as a novel interconnect technology while TPL has extensive experience in developing packaging solutions for the electronics industry. One of the unique advantages of soft lithography is the ability