Microfabrication and 3D Packaging Techniques for Liquid Crystal Polymers (LCP)

Foster-Miller, in this proposed SBIR effort, will develop and demonstrate microfabrication and 3-D packaging techniques for a new class of electronic substrate materials known as LCPs. Foster-Miller has been developing an electronic packaging technologybased on these innovative LCPs for microwave multichip modules, advanced surface mount printed wiring boards and optoelectronic applications. We believe that LCPs have several advantages for use as MEMS substrates, including:Low substrate costLarge substrate areaDemonstrated compatibility with microfabrication processesFlexibility of LCP materials will allow designers to consider flexible and bendable MEMS structureWhile the basic focus of this program is to develop microfabrication processes and demonstrate the ability to form microstructures in LCPs, consideration must also be given to the eventual packaging and integration of the MEMS system. In fact, many MEMSexperts will tell you that packaging and interconnection is one of the biggest issues facing MEMS today. Bearing this in mind, our ultimate aim, by the end of the Phase II program, is to develop a 3-D integration of the MEMS structures, associatedcomponents and the system packaging and interconnection. We believe that LCPs offer the best approach to achieving this ultimate goal. (P-020513)This program will develop and demonstrate a low-cost MEMS device technology based on LCP substrates. This technology will allow for lower cost sensors and actuators for a host of applications ranging from photonics, biosensing, inertial and vibrationsensing, to mention but a few. The need for MEMS-based devices is fueled by ever-shrinking consumer and telecommunications products and this technology will provide a low-cost solution to these markets.