Polymer Microfabrication Techniques for Microelectromechanical Systems (MEMS)

"In this proposed Phase I effort, Foster-Miller will develop and demonstrate microfabrication and 3D packaging techniques for a new class of electronic substrate materials known as liquid crystal polymers (LCPs). Foster-Miller has been developing anelectronic packaging technology based on these innovative LCPs for microwave multichip modules, advanced surface mount printed wiring boards and optoelectronic applications. We believe that LCPs have several advantages for use as MEMS substrates,including: Low substrate cost. Large substrate area. Demonstrated compatibility with microfabrication processes. Flexibility of LCP materials will allow designers to consider flexible and bendable MEMS structure.While the basic focus of this program is to develop microfabrication processes and demonstrate the ability to form microstructures in LCPs, consideration must also be given to the eventual packaging and integration of the MEMS system. In fact, many MEMSexperts will tell you that packaging and interconnection is one of the biggest issues facing MEMS today. Bearing this in mind, our ultimate aim, by the end of a Phase II program, is to develop a 3D integration of the MEMS structures, associated componentsand the system packaging and interconnection. We believe that LCPs offer the best approach to achieving this ultimate goal. (P-0200012) This program will develop and demonstrate a low-cost MEMS device technology