High Reliability, Low Cost Rigid-Flex PWBs Using Liquid Crystal Polymers with Enhanced Dielectric Properties

Foster-Miller proposes to develop low cost rigid-flex materials based on their innovative Liquid Crystal Polymer technology. The LCP materials have excellent thermal and mechanical properties. LCPs are high temperature thermoplastics that eliminate the need for adhesion layers that cause many of the processing difficulties. The entire rigid flex package can be made out of a system of LCP materials providing very high reliability and low cost. Foster-Miller will coextrude materials using their innovative counter-rotating die technology to achieve an optimum blend of desirable properties. Dielectric constant including low CTE (2.6), (4 to 8 ppm/K). LCPs have been proven to be compatible mechanical and laser drilling, electroplating, and plasma processing. In Phase I, teaming with Teledyne Electronics Technology, a leading supplier of flex and rigid flex, we will select several LCP materials to be metallized, tested and processed into sample circuits. The reliability of these materials will be demonstrated by performing a full range of military and industry testing. In Phase II, we will build prototypes using materials selected in Phase I. We will also work with Allied Signal Laminates, the leading electronic substrate manufacturer to commercialize the films. OPTION TASK: $19,940