LCP-GRAPHITE COMPOSITES FOR THERMALLY CONDUCTIVE HEAT SINKS

LIQUID CRYSTALLINE POLYMERS (LCP) REINFORCED BY NEWLY DEVELOPED ULTRAHIGH CONDUCTIVITY GRAPHITE FIBERS CAN MEET THE CHALLENGING REQUIREMENTS OF THERMAL MANAGEMENT AND CONTROLLED THERMAL EXPANSION FOR NAVAL SHIP, SUBMARINE, AIRCRAFT, AND SPACE-BASED ELECTRONIC DEVICES HEAT SINKS. THE PROPOSED EFFORT WILL DEMONSTRATE AN INNOVATIVE FABRICATION METHOD TO PRODUCE ELECTRONIC DEVICE SUBSTRATES FROM ORDERED LIQUID CRYSTALLINE POLYMERS WITH THERMAL CONDUCTIVITY ABOVE 250 W/M DEG K AND A CTE OF 5 PPM/DEG K (2.8 PPM/DEG F). FOSTER-MILLER WILL APPLY ITS PROPRIETARY FILM PROCESSING TECHNIQUES TO COMBINE NEW ULTRAHIGH CONDUCTIVITY GRAPHITE FIBERS INTO LCP SUBSTRATES TO PROVIDE STATE-OF-THE-ART THERMAL MANAGEMENT IN NEW HIGH PERFORMANCE ELECTRONIC PACKAGES. DURING PHASE I, LCP/GRAPHITE COMPOSITE LAMINATES WILL BE FABRICATED AND EVALUATED AGAINST CONTEMPORARY CHIP SUBSTRATE MATERIALS BASED ON THERMAL AND MECHANICAL PERFORMANCE PARAMETERS. DURING PHASE II, A SPECIFIC NAVY ELECTRONIC COMPONENT WILL BE CHOSEN FOR INTEGRATION WITH THESE NOVEL HEAT SINKS AND PARTS WILL BE FABRICATED USING THIS INNOVATIVE TECHNOLOGY. THE FABRICATION OF AN ACTUAL DEVICE SUBSTRATE COMPONENT AT POTENTIALLY LOW COST, AND THE DEMONSTRATION OF THEIR SUPERIORITY OVER CURRENT TECHNOLOGY, WILL ESTABLISH A FIRM BASIS FOR A COMMERCIALLY SUPPORTED PHASE III PROGRAM.