In-Situ Control Using Spectral Pyrometric Interferometry for Electronics Manufacturing

The future manufacturing of electronic devices will require even better control of the manufacturing process. Temperature and thin film thickness are two most critical variables in many production processes such as chemical vapor deposition (CVD), rapid thermal processing (RTP), and plasma etching. We will invesigate a unique spectral optical pyrometric interferometry (SPI) for closed loop control of the two parameters in these processes. The SPI technique utilizes the changing interference effects in the surface layer to measure water temperature and layer thickness resolution of 0.5 nm are amongst the best known of any techniques. We will demonstrate that data acquired from the measurements can be used for feedback control of the processes. Because the technique is non-invasive, insensitive to mechanical vibrations and hostile environments, and can be done in real time, SPI is truly suited for electronics manufacturing as well as for quality inspection applications. Anticipated Benefits: The spectral pyrometric interferometry technique is an enabling technique for electronics manufacturing. It can increase the production yield of high performance electronics by improved control of important process variables. The technique can be widely used in many semiconductor manufacturing processes essential for consumer electronics.