Stacked NbN Superconducting Digital Signal Processors for FPAs

"Irvine Sensors Corporation in collaboration with TRW, proposes to develop a short stack consisting of 3-4 layers of digital signal processing superconducting electronic chips to perform on-board data processing and data compression for low temperature (10K) advanced focal plane arrays (FPA). Superconducting Electronics (SCE) circuits based on NbN junctions have direct compatibility with the operating temperatures of focal plane arrays with minimal added thermal load to the cooler. The innovation in thisprogram will be the first-ever demonstration of considerable amount of data processing next to the (FPA) without compromising physical size and power budget. The innovation is enabled by advanced stacking techniques coupled with NbN based SCE circuits.Advanced 3D stacking allow fitting many chips and therefore a large amount of data processing power into a very small footprint. The signal processing functions available and very low cryogenic power dissipation of superconducting electronics offercompelling system level advantages for both interceptor and space surveillance applications. The migration of advanced 3D stacking technologies to low service temperature range (about 5-77 K) will also impact other high performance computing andcommunication applications."