Manufacture of Multi-Chip Modules by Jet Vapor Deposition

We propose to develop our innovative, proprietary, pollution-free, Jet Vapor Deposition process for low-cost, high rate fabrication of high quality component layers for multi-chip modules (MCMs). This SBIR project will be carried out in collaboration with NCHIP, Inc. (San Jose CA) a leading developer of MCM technology. In Phase I, we will develop and demonstrate scaled-up JVD processes to coat 125 mm silicon wafers with high quality, micron-scale aluminum conductor layers and silicon-dioxide insulating films. We will characterize the Phase I sample materials properties with regard to nCHIP's quality specifications, including unifromity, stress, adhesion and electronic performance. If Phase I is successful, we will collaborate with nCHIP in Phase II to optimize the JVD processes and equipment for low cost, automated manufacture of multichip modules. We will commercialize results of this SBIR program through licensing use of JVD MCM production equipment for the MCM industry, thus achieving important transfer of technology. Anticipated Benefits: Mutli-chip modules are a "dual use" technology, widely recongized as a future high growth segment of the electronics industry. However, this potential depends critically on reduction in module costs. The proposed research offers potential for significant reduction in manufacturing costs.