Environmentally Conscious Solder Process for Manual/Bench Application

Foster-Miller proposes the development of unique Isotropic Conducting Adhesives (ICA's) that will yield an enviromentally safe joining method for manual and bench operations. Our concept is based on the development of a proprietary technology to improve the mechanical behavior of ICA's. The technology we propose will also increase the resistance of the ICA's metal filler to oxidation, thereby improving the stability of the joint resistance, especially in harsh environments. The ICA's we develop will rely on copper, rather than silver, as the conducting medium. This advance will lower cost and eliminate concerns over silver migration. Our test plan will compare the performance of our novel ICAs to commercially available materials. Performance tests to be conducted include lap shear, junction stability in high humidity and high temperature environments, and a drop test. If successful, the ICAs that we develop will be a suitable general replacement for lead- bearing solder in electronics.