Modular Open Architecture for Small Form Factor Technology (MOAST)

To address U.S. Navy’s need for Small Form Factor (SFF), open-architecture payloads, Ansync Labs, in partnership with Valley Tech Systems, Inc. proposes to research and design around a VNX+ and VPX compatible Two Module Powered Midplane (TMPM) architecture. Our intended architecture allows for interoperability and interchangeability of different edge based High Performance Computing (HPC) modules such as the NVIDIA Jetson Orin or FPGA processing elements and, separately, different high bandwidth AFE (Adaptive Front End) RF modules capable of wideband Electronic Warfare (EW), Radar, and Command, Control, Computing, Communications, Cyber, Intelligence, Surveillance, Reconnaissance, and Targeting (C5ISRT) missions.   The innovation is divided into TMPM architectural features and implementation specifics. At the highest level, the architecture recognizes some of the compromises of a backplane approach, particularly for small SWaP applications. In our TMPM architecture, we extend the idea of connector profiles used in VNX+ to module profiles. The right-angle backplane (which consumes 23% of the usable area in VNX+) is replaced by a midplane interconnect that provides power supply and inter-system communications. Limiting individual systems to two specific modules profiles allows for the implementation of most use-cases, brings thermals to the outside of the mechanical envelope, helps standardize the midplane carrier, eliminates a portion of the weight tax associated with a card cage, and reduces the complexity of removing heat from buried modules.   We have termed the two module profiles as Processing and RF. We have further specified they are offered in two sizes, Type V and Type C. Type V modules are 8cm x 5cm (Similar to ComExpress Type 10) and fit on VNX+ carrier board. Two Type V modules fit on a VPX carrier board. When used as a Type V stand-alone system, the complete system (with power supply and interconnect) measures 35mm x 100mm x 75mm. The Type C form factor modules are 2.5cm x 8cm individually. (Similar to M.2) Two Type C modules fit on a VNX+ carrier board. A complete system of Type C modules can be constructed within 2.5cmx2.5cmx10cm.      We created a Phase I development plan is based on successful development efforts that focus on sUAS payloads, microelectronics design and fabrication, and EW/SIGINT sensing systems. The plan identifies development milestones such as System Requirements Review, Open Architecture Technical Interchange Meetings, and Design Reviews that will guide our engineering team through successful design and prototype of Small Form Factor payloads. Phase I technical objectives to successfully mature the SFF payload technology to a goal of TRL-4 include: Satisfying the modularity and scalability objectives Maximizing the incorporation of open standardsOffering research to advance a U.S. Government or Industry standardSatisfying the wideband multifunction RF payload technical specifications