Readout Integrated Circuits (ROIC) Development for High Performance, Uncooled Imaging Applications

"ISC proposes to utilize its 3D Stacking technology to reduce the volume of a LADAR receiver system. THe use of stacking technology allows the additional real estate associated with each unit cell to be increased by 3-4 orders of magnitude overconventional designs. This feature opens up the possibility to use inductive components in the readout design. These devices can be used to improve the signal to noise ratio of the InGaAs PIN detectors. This represents a second approach to achieving therequired performance in high speed 3D active imaging without the need for tube or avalanche photo diode technology. The reduction in receiver electronics can greatly improve the marketability of commercial 3D imaging systems. The areas of most significantgrowth would be in the industrial applications associated with civil and mechanical engineering. A similar reduction in the volume of the transmitter would complete the tranformation from a moderate to a miniature imaging system. ISC would team with anindustrial 3D LADAR manufacturer as part of its commercialization plan."