Monolithically Integrated Transmit, High-speed-analog, Receive, and Integrated Laser (MITHRIL) chiplets for intra-satellite data transfer

Optical I/O chiplet technology has been demonstrated for terrestrial applications, but several critical parameters prevent its use for intra-satellite optical communication: insufficient SWaP and an insufficient degree of reliability and robustness required for long-term use in space environments. This phase I project focuses on the development of packaged optical I/O chiplets suitable for intra-satellite chip to chip links by utilizing a monolithically integrated CMOS-photonics fabrication process in combination with photonic wirebond packaging.Ā Monolithic electronic-photonic chiplets enable extremely low SWaP systems with fiber optic interfaces. To address the reliability and robustness for space applications, photonic wirebonding technology will be used to provide robust interconnections between fiber and chip. The project builds on existing optical I/O chiplets provided by Enosemi that were previously demonstrated to deliver 3.5 Tbps of bidirectional bandwidth with 4.3 pJ/bit energy efficiency. A detailed design tradeoff and feasibility study will be performed to determine key chiplet architectures suitable for the space environment that will tolerate the radiation environment with exceptional SWaP criteria. Freedom Photonics will perform photonic wirebonding to an existing chiplet to demonstrate feasibility and determine paths for scalable and stable optical systemsĀfor intra-satellite communication.Ā Detailed simulations and study will be performed to assess the suitability of the existing 3.5 Tbps optical I/O chiplets for the space-based operating environment for critical high-level performance metrics as well as sub-circuit capabilities. Photonic wirebonding has been preeviously demonstrated to show excellent temperature, vibration, and radiation tolerance. To assess the feasibility of photonic wirebonding to a monolithic CMOS+photonics optical I/O chiplet a prototype assembly will be constructed as part of a phase I study. The learnings from the phase I program will enable a detailed roadmap plan to be developed for a phase II program with identified qualification risks.