SBIR/STTR Research Award

Development of Versatile Wafer Probe System for High Power Devices

Award identifier 7e6d5e7fe2ed929c8c10f2920654c6cb12b4fda40a8cbaf9bb93692026e07a05Awarding agency Department of Defense · Defense Microelectronics Activity

Award amount

$197,168

Program and phase

SBIR · Phase I

Award year

2024

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Award details

Awarding agency
Department of Defense
Branch
Defense Microelectronics Activity
Recipient company
MICROXACT INC.
Proposal award date
2024-07-03
Contract end date
2025-01-10
UEI
TKKMJWZJC2W5
Solicitation number
24.1
Topic code
DMEA241-002

Research abstract

High power electronics market and applications are booming due to the need of such devices in plugin electric vehicles, home appliances, aerospace and defense applications. Wide bandgap semiconductors, such as SiC, are the most promising materials for high power metal-oxide semiconductor field-effect transistors, diodes, and insulated-gate bipolar transistors. There is a constant need among all the applications for more powerful devices, requiring in turn higher power and higher voltage-capable probe stations and auxiliary equipment. At present, commercially available probe stations are rated up to 10kV DC at +200OC and up to 30A DC (600A pulsed). However, extension of the voltage and current limits to 40kV and 500A pulsed/10A DC, while also extending the temperature range of probing, is needed for defense, aerospace and commercial applications. The team and MicroXact Inc. and CoolCAD Electronics LLC is proposing to develop a high power (40kV and 10A DC/ 500A pulse rated), semi-auto, 200mm, high vacuum liquid nitrogen-cooled thermal (80K to 700K temperature range) probe station for testing high power and high voltage devices, such as wide band semiconductor metal-oxide semiconductor field-effect transistors, diodes, and insulated-gate bipolar transistors. In Phase I of the project the team will finalize the performance specifications with DMEA personnel, will develop the mechanical, thermal and electrical models and design of the proposed system, will develop, build and evaluate 1 generation prototype of high power probe, of high voltage chuck, and 200mm high thermal load chuck and will verify system feasibility and performance via numerical modeling and experiments. In addition, a detailed commercialization and transition to marketing strategy will be developed as well as the Phase II work plan. In Phase II, MicroXact will procure 3rd party components, fabricate our own parts, assemble and perform rigorous testing of the high power probe station to insure it’s functionality and safety. During the later months of Phase II, a prototype high power probe station will be delivered and installed at DMEA and training of DMEA personnel will be performed. The solution developed on this SBIR project will be commercialized immediately after Phase II completion.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

25 SBIR/STTR records share this UEI (2009–2025). Reported award amounts total $8,900,811. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Commerce

Agency intelligence

Department of Defense

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