Hokkien Low Density Language Capability
Award amount
$1,303,513Program and phase
SBIR · Phase IIAward year
2024Award details
- Awarding agency
- Department of Defense
- Branch
- Special Operations Command
- Recipient company
- FEMTOSENSE, INC.
- Proposal award date
- 2024-06-13
- Contract end date
- 2025-06-16
- UEI
- K9TJHBLAPAA3
- Solicitation number
- 23.2
- Topic code
- SOCOM232-002
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Low-Power Sparse AI Processing for Enhanced ISR Communications with Femtosense’s SPU-001 Chip
- A Sparse AI Solution for Real-time Edge
- Hokkien Low Density Language Capability
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Hokkien Low Density Language Capability
- Hokkien Low Density Language Capability
- Hokkien Low Density Language Capability
- Hokkien Low Density Language Capability
Research funding history
4 SBIR/STTR records share this UEI (2023–2025). Reported award amounts total $1,628,474. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense