High Voltage Encapsulant Material

Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several different chemistries have been explored, they fail under the prolonged simultaneous exposure to high humidity, high temperature, high voltage and wide frequency ranges. Hence, in this project, LaunchBay proposes to develop a superior encapsulant based on a novel approach and demonstrate its feasibility in high temperature power electronic device packaging. Relevant physical, thermal and electrical properties of the encapsulant will be measured and compared to the commercial alternatives. The encapsulant developed in this program will be not only resilient but also compatible with the existing manufacturing/encapsulating techniques in the packaging industry.