SBIR/STTR Research Award

AC-LGAD silicon detectors with alternate gain layer for improved reliability

Award identifier 1de2daa9c2a0adcbc7c6181542b6d1e4190eb0dbb2b5a4565134745e3d4d0021Awarding agency Department of Energy

Award amount

$206,493

Program and phase

SBIR · Phase I

Award year

2023

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
EPIR, INC.
Proposal award date
2023-02-21
Contract end date
2024-02-20
UEI
CC7WWF3GJ253
Solicitation number
Not reported
Topic code
C55-22c

Research abstract

C55-22c-270318More stringent challenges, as required by future high energy physics experiments, require higher radiation tolerance and higher granularity to the silicon detectors. Recently developed precision timing detector technology based on silicon Low Gain Avalanche Diode (LGAD) although exhibits excellent timing performance, cannot attain 10 µm position resolution needed for advanced 4D detectors. Also, owing to the shallow implant design of the gain layer, the radiation tolerance of LGADs is limited. Gain layer design with tolerance to higher irradiation fluences as well as detector design that allows shrinking the pixel pitch is desired for future detector upgrades. Optimization of the buried junction design with considerations to dopant layer depth and width by modeling AC coupled LGAD (AC-LGAD) device geometry using Technology Computer Aided Design (TCAD). Effectiveness of deep trench as junction termination edge (JTE) will also be validated for improved breakdown reliability. Modeling efforts will be complemented by experimental methods to develop buried junction layers with in-situ doping strategies of epitaxial silicon layers. The Phase I effort is aimed at developing TCAD models to determine optimum position, doping levels and JTE of the buried junction sensor design in order to improve the overall gain, radiation hardness and breakdown reliability of the detector in AC-LGAD geometry. Concurrently, experimental methods will be developed to achieve buried junction at variable depths by exploring epitaxial growth of silicon. In-situ doping will be explored to achieve tunable and hyper abrupt gain layer profile. Deep trench geometries will be explored for junction terminations. Secondary Ion Mass Spectroscopy (SIMS) depth profiling will be used to map depth and dopant concentration to validate the grown films. Radiation hard, high granularity detectors will find immediate application in detector chips to be used in MIP Timing Detector to be deployed as part of the CMS Upgrade at CERN as well as newly conceived advanced Electron-Ion Collider (EIC) for precision timing and position application. Longer term applications include full vertically integrated highly segmented, high-density detectors for nuclear particle detectors, and a wide variety of medical imaging applications such as Clinical dosimetry, Positron Emission Tomography (PET) to name a few.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

33 SBIR/STTR records share this UEI (2014–2026). Reported award amounts total $14,424,413. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration

Agency intelligence

Department of Energy

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